Method for manufacturing an inkjet nozzle that incorporates heater actuator arms

ABSTRACT

A method is provided for manufacturing an inkjet nozzle. The method includes the step of depositing a plastics material layer on a substrate incorporating heater actuator circuitry. The plastics material layer is etched to form a nozzle rim defining an ink port through which ink can be ejected and a plurality of elongate actuator arms extending radially with respect to the nozzle rim. A tapered ink chamber may be etched in the nozzle body so that the ink port and ink chamber are in fluid communication with each other.

CROSS REFERENCES TO RELATED APPLICATIONS

This is a Continuation of U.S. application Ser. No. 11/450,445 filed onJun. 12, 2006, now issued as U.S. Pat. No. 7,156,498, which is aContinuation of U.S. application Ser. No. 11/000,936 filed on Dec. 2,2004, now issued as U.S. Pat. No. 7,156,494, which is a Continuation ofU.S. application Ser. No. 09/854,830 filed on May 15, 2001, now issuedU.S. Pat. No. 7,021,746, which is a Continuation of U.S. applicationSer. No. 09/112,806 filed on Jul. 10, 1998, now issued U.S. Pat. No.6,247,790 all of which are herein incorporated by reference.

The following Australian provisional patent applications are herebyincorporated by cross-reference. For the purposes of location andidentification, US patent applications identified by their US patentapplication serial numbers (USSN) are listed alongside the Australianapplications from which the US patent applications claim the right ofpriority.

U.S. Pat. No./patent CROSS-REFERENCED application Ser. No. AUSTRALIAN(CLAIMING RIGHT OF PROVISIONAL PRIORITY FROM PATENT AUSTRALIANPROVISIONAL DOCKET APPLICATION NO. APPLICATION) NO. PO7991 6750901ART01US PO8505 6476863 ART02US PO7988 6788336 ART03US PO9395 6322181ART04US PO8017 6597817 ART06US PO8014 6227648 ART07US PO8025 6727948ART08US PO8032 6690419 ART09US PO7999 6727951 ART10US PO8030 6196541ART13US PO7997 6195150 ART15US PO7979 6362868 ART16US PO7978 6831681ART18US PO7982 6431669 ART19US PO7989 6362869 ART20US PO8019 6472052ART21US PO7980 6356715 ART22US PO8018 6894694 ART24US PO7938 6636216ART25US PO8016 6366693 ART26US PO8024 6329990 ART27US PO7939 6459495ART29US PO8501 6137500 ART30US PO8500 6690416 ART31US PO7987 7050143ART32US PO8022 6398328 ART33US PO8497 7110024 ART34US PO8020 6431704ART38US PO8504 6879341 ART42US PO8000 6415054 ART43US PO7934 6665454ART45US PO7990 6542645 ART46US PO8499 6486886 ART47US PO8502 6381361ART48US PO7981 6317192 ART50US PO7986 6850274 ART51US PO7983 09/113054ART52US PO8026 6646757 ART53US PO8028 6624848 ART56US PO9394 6357135ART57US PO9397 6271931 ART59US PO9398 6353772 ART60US PO9399 6106147ART61US PO9400 6665008 ART62US PO9401 6304291 ART63US PO9403 6305770ART65US PO9405 6289262 ART66US PP0959 6315200 ART68US PP1397 6217165ART69US PP2370 6786420 DOT01US PO8003 6350023 FLUID01US PO8005 6318849FLUID02US PO8066 6227652 IJ01US PO8072 6213588 IJ02US PO8040 6213589IJ03US PO8071 6231163 IJ04US PO8047 6247795 IJ05US PO8035 6394581 IJ06USPO8044 6244691 IJ07US PO8063 6257704 IJ08US PO8057 6416168 IJ09US PO80566220694 IJ10US PO8069 6257705 IJ11US PO8049 6247794 IJ12US PO80366234610 IJ13US PO8048 6247793 IJ14US PO8070 6264306 IJ15US PO80676241342 IJ16US PO8001 6247792 IJ17US PO8038 6264307 IJ18US PO80336254220 IJ19US PO8002 6234611 IJ20US PO8068 6302528 IJ21US PO80626283582 IJ22US PO8034 6239821 IJ23US PO8039 6338547 IJ24US PO80416247796 IJ25US PO8004 6557977 IJ26US PO8037 6390603 IJ27US PO80436362843 IJ28US PO8042 6293653 IJ29US PO8064 6312107 IJ30US PO93896227653 IJ31US PO9391 6234609 IJ32US PP0888 6238040 IJ33US PP08916188415 IJ34US PP0890 6227654 IJ35US PP0873 6209989 IJ36US PP09936247791 IJ37US PP0890 6336710 IJ38US PP1398 6217153 IJ39US PP25926416167 IJ40US PP2593 6243113 IJ41US PP3991 6283581 IJ42US PP39876247790 IJ43US PP3985 6260953 IJ44US PP3983 6267469 IJ45US PO79356224780 IJM01US PO7936 6235212 IJM02US PO7937 6280643 IJM03US PO80616284147 IJM04US PO8054 6214244 IJM05US PO8065 6071750 IJM06US PO80556267905 IJM07US PO8053 6251298 IJM08US PO8078 6258285 IJM09US PO79336225138 IJM10US PO7950 6241904 IJM11US PO7949 6299786 IJM12US PO80606866789 IJM13US PO8059 6231773 IJM14US PO8073 6190931 IJM15US PO80766248249 IJM16US PO8075 6290862 IJM17US PO8079 6241906 IJM18US PO80506565762 IJM19US PO8052 6241905 IJM20US PO7948 6451216 IJM21US PO79516231772 IJM22US PO8074 6274056 IJM23US PO7941 6290861 IJM24US PO80776248248 IJM25US PO8058 6306671 IJM26US PO8051 6331258 IJM27US PO80456110754 IJM28US PO7952 6294101 IJM29US PO8046 6416679 IJM30US PO93906264849 IJM31US PO9392 6254793 IJM32US PP0889 6235211 IJM35US PP08876491833 IJM36US PP0882 6264850 IJM37US PP0874 6258284 IJM38US PP13966312615 IJM39US PP3989 6228668 IJM40US PP2591 6180427 IJM41US PP39906171875 IJM42US PP3986 6267904 IJM43US PP3984 6245247 IJM44US PP39826315914 IJM45US PP0895 6231148 IR01US PP0869 6293658 IR04US PP08876614560 IR05US PP0885 6238033 IR06US PP0884 6312070 IR10US PP08866238111 IR12US PP0877 6378970 IR16US PP0878 6196739 IR17US PP08836270182 IR19US PP0880 6152619 IR20US PO8006 6087638 MEMS02US PO80076340222 MEMS03US PO8010 6041600 MEMS05US PO8011 6299300 MEMS06US PO79476067797 MEMS07US PO7944 6286935 MEMS09US PO7946 6044646 MEMS10US PP08946382769 MEMS13US

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

FIELD OF THE INVENTION

The present invention relates to the field of inkjet printing and, inparticular, discloses an inverted radial back-curling thermoelastic inkjet printing mechanism.

BACKGROUND OF THE INVENTION

Many different types of printing mechanisms have been invented, a largenumber of which are presently in use. The known forms of printers have avariety of methods for marking the print media with a relevant markingmedia. Commonly used forms of printing include offset printing, laserprinting and copying devices, dot matrix type impact printers, thermalpaper printers, film recorders, thermal wax printers, dye sublimationprinters and ink jet printers both of the drop on demand and continuousflow type. Each type of printer has its own advantages and problems whenconsidering cost, speed, quality, reliability, simplicity ofconstruction and operation etc.

In recent years the field of ink jet printing, wherein each individualpixel of ink is derived from one or more ink nozzles, has becomeincreasingly popular primarily due to its inexpensive and versatilenature.

Many different techniques of ink jet printing have been invented. For asurvey of the field, reference is made to an article by J Moore,“Non-Impact Printing: Introduction and Historical Perspective”, OutputHard Copy Devices, Editors R Dubeck and S Sherr, pages 207-220 (1988).

Ink Jet printers themselves come in many different forms. Theutilization of a continuous stream of ink in ink jet printing appears todate back to at least 1929 wherein U.S. Pat. No. 1,941,001 by Hanselldiscloses a simple form of continuous stream electro-static ink jetprinting.

U.S. Pat. No. 3,596,275 by Sweet also discloses a process of acontinuous ink jet printing including a step wherein the ink jet streamis modulated by a high frequency electro-static field so as to causedrop separation. This technique is still utilized by severalmanufacturers including Elmjet and Scitex (see also U.S. Pat. No.3,373,437 by Sweet et al).

Piezoelectric ink jet printers are also one form of commonly utilizedink jet printing device. Piezoelectric systems are disclosed by Kyseret. al. in U.S. Pat. No. 3,946,398 (1970) which utilizes a diaphragmmode of operation, by Zolten in U.S. Pat. No. 3,683,212 (1970) whichdiscloses a squeeze mode form of operation of a piezoelectric crystal,Stemme in U.S. Pat. No. 3,747,120 (1972) which discloses a bend mode ofpiezoelectric operation, Howkins in U.S. Pat. No. 4,459,601 whichdiscloses a piezoelectric push mode actuation of the ink jet stream andFischbeck in U.S. Pat. No. 4,584,590 which discloses a shear mode typeof piezoelectric transducer element.

Recently, thermal ink jet printing has become an extremely popular formof ink jet printing. The ink jet printing techniques include thosedisclosed by Endo et al in GB 2007162 (1979) and Vaught et al in U.S.Pat. No. 4,490,728. Both the aforementioned references disclose ink jetprinting techniques which rely on the activation of an electrothermalactuator which results in the creation of a bubble in a constrictedspace, such as a nozzle, which thereby causes the ejection of ink froman aperture connected to the confined space onto a relevant print media.Printing devices utilizing the electro-thermal actuator are manufacturedby manufacturers such as Canon and Hewlett Packard.

As can be seen from the foregoing, many different types of printingtechnologies are available. Ideally, a printing technology should have anumber of desirable attributes. These include inexpensive constructionand operation, high speed operation, safe and continuous long termoperation etc. Each technology may have its own advantages anddisadvantages in the areas of cost, speed, quality, reliability, powerusage, simplicity of construction and operation, durability andconsumables.

SUMMARY OF THE INVENTION

In accordance with a first aspect of the present invention, there isprovided a nozzle arrangement for an ink jet printhead, the arrangementcomprising: a nozzle chamber defined in a wafer substrate for thestorage of ink to be ejected; an ink ejection port having a rim formedon one wall of the chamber; and a series of actuators attached to thewafer substrate, and forming a portion of the wall of the nozzle chamberadjacent the rim, the actuator paddles further being actuated in unisonso as to eject ink from the nozzle chamber via the ink ejection nozzle.

The actuators can include a surface which bends inwards away from thecentre of the nozzle chamber upon actuation. The actuators arepreferably actuated by means of a thermal actuator device. The thermalactuator device may comprise a conductive resistive heating elementencased within a material having a high coefficient of thermalexpansion. The element can be serpentine to allow for substantiallyunhindered expansion of the material. The actuators are preferablyarranged radially around the nozzle rim.

The actuators can form a membrane between the nozzle chamber and anexternal atmosphere of the arrangement and the actuators bend away fromthe external atmosphere to cause an increase in pressure within thenozzle chamber thereby initiating a consequential ejection of ink fromthe nozzle chamber. The actuators can bend away from a central axis ofthe nozzle chamber.

The nozzle arrangement can be formed on the wafer substrate utilizingmicro-electro mechanical techniques and further can comprise an inksupply channel in communication with the nozzle chamber. The ink supplychannel may be etched through the wafer. The nozzle arrangement mayinclude a series of struts which support the nozzle rim.

The arrangement can be formed adjacent to neighbouring arrangements soas to form a pagewidth printhead.

BRIEF DESCRIPTION OF THE DRAWINGS

Notwithstanding any other forms which may fall within the scope of thepresent invention, preferred forms of the invention will now bedescribed, by way of example only, with reference to the accompanyingdrawings in which:

FIGS. 1-3 are schematic sectional views illustrating the operationalprinciples of the preferred embodiment;

FIG. 4( a) and FIG. 4( b) are again schematic sections illustrating theoperational principles of the thermal actuator device;

FIG. 5 is a side perspective view, partly in section, of a single nozzlearrangement constructed in accordance with the preferred embodiments;

FIGS. 6-13 are side perspective views, partly in section, illustratingthe manufacturing steps of the preferred embodiments;

FIG. 14 illustrates an array of ink jet nozzles formed in accordancewith the manufacturing procedures of the preferred embodiment;

FIG. 15 provides a legend of the materials indicated in FIGS. 16 to 23;and

FIG. 16 to FIG. 23 illustrate sectional views of the manufacturing stepsin one form of construction of a nozzle arrangement in accordance withthe invention.

DESCRIPTION OF PREFERRED AND OTHER EMBODIMENTS

In the preferred embodiment, ink is ejected out of a nozzle chamber viaan ink ejection port using a series of radially positioned thermalactuator devices that are arranged about the ink ejection port and areactivated to pressurize the ink within the nozzle chamber therebycausing the ejection of ink through the ejection port.

Turning now to FIGS. 1, 2 and 3, there is illustrated the basicoperational principles of the preferred embodiment. FIG. 1 illustrates asingle nozzle arrangement 1 in its quiescent state. The arrangement 1includes a nozzle chamber 2 which is normally filled with ink so as toform a meniscus 3 in an ink ejection port 4. The nozzle chamber 2 isformed within a wafer 5. The nozzle chamber 2 is supplied with ink viaan ink supply channel 6 which is etched through the wafer 5 with ahighly isotropic plasma etching system. A suitable etcher can be theAdvance Silicon Etch (ASE) system available from Surface TechnologySystems of the United Kingdom.

A top of the nozzle arrangement 1 includes a series of radiallypositioned actuators 8, 9. These actuators comprise apolytetrafluoroethylene (PTFE) layer and an internal serpentine coppercore 17. Upon heating of the copper core 17, the surrounding PTFEexpands rapidly resulting in a generally downward movement of theactuators 8, 9. Hence, when it is desired to eject ink from the inkejection port 4, a current is passed through the actuators 8, 9 whichresults in them bending generally downwards as illustrated in FIG. 2.The downward bending movement of the actuators 8, 9 results in asubstantial increase in pressure within the nozzle chamber 2. Theincrease in pressure in the nozzle chamber 2 results in an expansion ofthe meniscus 3 as illustrated in FIG. 2.

The actuators 8, 9 are activated only briefly and subsequentlydeactivated. Consequently, the situation is as illustrated in FIG. 3with the actuators 8, 9 returning to their original positions. Thisresults in a general inflow of ink back into the nozzle chamber 2 and anecking and breaking of the meniscus 3 resulting in the ejection of adrop 12. The necking and breaking of the meniscus 3 is a consequence ofthe forward momentum of the ink associated with drop 12 and the backwardpressure experienced as a result of the return of the actuators 8, 9 totheir original positions. The return of the actuators 8,9 also resultsin a general inflow of ink from the channel 6 as a result of surfacetension effects and, eventually, the state returns to the quiescentposition as illustrated in FIG. 1.

FIGS. 4( a) and 4(b) illustrate the principle of operation of thethermal actuator. The thermal actuator is preferably constructed from amaterial 14 having a high coefficient of thermal expansion. Embeddedwithin the material 14 are a series of heater elements 15 which can be aseries of conductive elements designed to carry a current. Theconductive elements 15 are heated by passing a current through theelements 15 with the heating resulting in a general increase intemperature in the area around the heating elements 15. The position ofthe elements 15 is such that uneven heating of the material 14 occurs.The uneven increase in temperature causes a corresponding unevenexpansion of the material 14. Hence, as illustrated in FIG. 4( b), thePTFE is bent generally in the direction shown.

In FIG. 5, there is illustrated a side perspective view of oneembodiment of a nozzle arrangement constructed in accordance with theprinciples previously outlined. The nozzle chamber 2 is formed with anisotropic surface etch of the wafer 5. The wafer 5 can include a CMOSlayer including all the required power and drive circuits. Further, theactuators 8, 9 each have a leaf or petal formation which extends towardsa nozzle rim 28 defining the ejection port 4. The normally inner end ofeach leaf or petal formation is displaceable with respect to the nozzlerim 28. Each activator 8, 9 has an internal copper core 17 defining theelement 15. The core 17 winds in a serpentine manner to provide forsubstantially unhindered expansion of the actuators 8, 9. The operationof the actuators 8, 9 is as illustrated in FIG. 4( a) and FIG. 4( b)such that, upon activation, the actuators 8 bend as previously describedresulting in a displacement of each petal formation away from the nozzlerim 28 and into the nozzle chamber 2. The ink supply channel 6 can becreated via a deep silicon back edge of the wafer 5 utilizing a plasmaetcher or the like. The copper or aluminum core 17 can provide acomplete circuit. A central arm 18 which can include both metal and PTFEportions provides the main structural support for the actuators 8, 9.

Turning now to FIG. 6 to FIG. 13, one form of manufacture of the nozzlearrangement 1 in accordance with the principles of the preferredembodiment is shown. The nozzle arrangement 1 is preferably manufacturedusing microelectromechanical (MEMS) techniques and can include thefollowing construction techniques:

As shown initially in FIG. 6, the initial processing starting materialis a standard semi-conductor wafer 20 having a complete CMOS level 21 toa first level of metal. The first level of metal includes portions 22which are utilized for providing power to the thermal actuators 8, 9.

The first step, as illustrated in FIG. 7, is to etch a nozzle regiondown to the silicon wafer 20 utilizing an appropriate mask.

Next, as illustrated in FIG. 8, a 2μ m layer of polytetrafluoroethylene(PTFE) is deposited and etched so as to define vias 24 forinterconnecting multiple levels.

Next, as illustrated in FIG. 9, the second level metal layer isdeposited, masked and etched to define a heater structure 25. The heaterstructure 25 includes via 26 interconnected with a lower aluminum layer.

Next, as illustrated in FIG. 10, a further 2 μm layer of PTFE isdeposited and etched to the depth of 1 μm utilizing a nozzle rim mask todefine the nozzle rim 28 in addition to ink flow guide rails 29 whichgenerally restrain any wicking along the surface of the PTFE layer. Theguide rails 29 surround small thin slots and, as such, surface tensioneffects are a lot higher around these slots which in turn results inminimal outflow of ink during operation.

Next, as illustrated in FIG. 11, the PTFE is etched utilizing a nozzleand actuator mask to define a port portion 30 and slots 31 and 32.

Next, as illustrated in FIG. 12, the wafer is crystallographicallyetched on a <111> plane utilizing a standard crystallographic etchantsuch as KOH. The etching forms a chamber 33, directly below the portportion 30.

In FIG. 13, the ink supply channel 34 can be etched from the back of thewafer utilizing a highly anisotropic etcher such as the STS etcher fromSilicon Technology Systems of United Kingdom. An array of ink jetnozzles can be formed simultaneously with a portion of an array 36 beingillustrated in FIG. 14. A portion of the printhead is formedsimultaneously and diced by the STS etching process. The array 36 shownprovides for four column printing with each separate column attached toa different colour ink supply channel being supplied from the back ofthe wafer. Bond pads 37 provide for electrical control of the ejectionmechanism.

In this manner, large pagewidth printheads can be fabricated so as toprovide for a drop-on-demand ink ejection mechanism.

One form of detailed manufacturing process which can be used tofabricate monolithic ink jet printheads operating in accordance with theprinciples taught by the present embodiment can proceed utilizing thefollowing steps:

1. Using a double-sided polished wafer 60, complete a 0.5 micron, onepoly, 2 metal CMOS process 61. This step is shown in FIG. 16. Forclarity, these diagrams may not be to scale, and may not represent across section though any single plane of the nozzle. FIG. 15 is a key torepresentations of various materials in these manufacturing diagrams,and those of other cross referenced ink jet configurations.

2. Etch the CMOS oxide layers down to silicon or second level metalusing Mask 1. This mask defines the nozzle cavity and the edge of thechips. This step is shown in FIG. 16.

3. Deposit a thin layer (not shown) of a hydrophilic polymer, and treatthe surface of this polymer for PTFE adherence.

4. Deposit 1.5 microns of polytetrafluoroethylene (PTFE) 62.

5. Etch the PTFE and CMOS oxide layers to second level metal using Mask2. This mask defines the contact vias for the heater electrodes. Thisstep is shown in FIG. 17.

6. Deposit and pattern 0.5 microns of gold 63 using a lift-off processusing Mask 3. This mask defines the heater pattern. This step is shownin FIG. 18.

7. Deposit 1.5 microns of PTFE 64.

8. Etch 1 micron of PTFE using Mask 4. This mask defines the nozzle rim65 and the rim at the edge 66 of the nozzle chamber. This step is shownin FIG. 19.

9. Etch both layers of PTFE and the thin hydrophilic layer down tosilicon using Mask 5. This mask defines a gap 67 at inner edges of theactuators, and the edge of the chips. It also forms the mask for asubsequent crystallographic etch. This step is shown in FIG. 20.

10. Crystallographically etch the exposed silicon using KOH. This etchstops on <111> crystallographic planes 68, forming an inverted squarepyramid with sidewall angles of 54.74 degrees. This step is shown inFIG. 21.

11. Back-etch through the silicon wafer (with, for example, an ASEAdvanced Silicon Etcher from Surface Technology Systems) using Mask 6.This mask defines the ink inlets 69 which are etched through the wafer.The wafer is also diced by this etch. This step is shown in FIG. 22.

12. Mount the printheads in their packaging, which may be a moldedplastic former incorporating ink channels which supply the appropriatecolor ink to the ink inlets 69 at the back of the wafer.

13. Connect the printheads to their interconnect systems. For a lowprofile connection with minimum disruption of airflow, TAB may be used.Wire bonding may also be used if the printer is to be operated withsufficient clearance to the paper.

14. Fill the completed print heads with ink 70 and test them. A fillednozzle is shown in FIG. 23.

The presently disclosed ink jet printing technology is potentiallysuited to a wide range of printing systems including: color andmonochrome office printers, short run digital printers, high speeddigital printers, offset press supplemental printers, low cost scanningprinters high speed pagewidth printers, notebook computers with inbuiltpagewidth printers, portable color and monochrome printers, color andmonochrome copiers, color and monochrome facsimile machines, combinedprinter, facsimile and copying machines, label printers, large formatplotters, photograph copiers, printers for digital photographic“minilabs”, video printers, PHOTO CD (PHOTO CD is a registered trademark of the Eastman Kodak Company) printers, portable printers for PDAs,wallpaper printers, indoor sign printers, billboard printers, fabricprinters, camera printers and fault tolerant commercial printer arrays.

It would be appreciated by a person skilled in the art that numerousvariations and/or modifications may be made to the present invention asshown in the specific embodiments without departing from the spirit orscope of the invention as broadly described. The present embodimentsare, therefore, to be considered in all respects to be illustrative andnot restrictive.

Ink Jet Technologies

The embodiments of the invention use an ink jet printer type device. Ofcourse many different devices could be used. However presently popularink jet printing technologies are unlikely to be suitable.

The most significant problem with thermal ink jet is power consumption.This is approximately 100 times that required for high speed, and stemsfrom the energy-inefficient means of drop ejection. This involves therapid boiling of water to produce a vapor bubble which expels the ink.Water has a very high heat capacity, and must be superheated in thermalink jet applications. This leads to an efficiency of around 0.02%, fromelectricity input to drop momentum (and increased surface area) out.

The most significant problem with piezoelectric ink jet is size andcost. Piezoelectric crystals have a very small deflection at reasonabledrive voltages, and therefore require a large area for each nozzle.Also, each piezoelectric actuator must be connected to its drive circuiton a separate substrate. This is not a significant problem at thecurrent limit of around 300 nozzles per printhead, but is a majorimpediment to the fabrication of pagewidth printheads with 19,200nozzles.

Ideally, the ink jet technologies used meet the stringent requirementsof in-camera digital color printing and other high quality, high speed,low cost printing applications. To meet the requirements of digitalphotography, new ink jet technologies have been created. The targetfeatures include:

low power (less than 10 Watts)

high resolution capability (1,600 dpi or more)

photographic quality output

low manufacturing cost

small size (pagewidth times minimum cross section)

high speed (<2 seconds per page).

All of these features can be met or exceeded by the ink jet systemsdescribed below with differing levels of difficulty. Forty-fivedifferent ink jet technologies have been developed by the Assignee togive a wide range of choices for high volume manufacture. Thesetechnologies form part of separate applications assigned to the presentAssignee as set out in the table below under the heading CrossReferences to Related Applications.

The ink jet designs shown here are suitable for a wide range of digitalprinting systems, from battery powered one-time use digital cameras,through to desktop and network printers, and through to commercialprinting systems.

For ease of manufacture using standard process equipment, the printheadis designed to be a monolithic 0.5 micron CMOS chip with MEMS postprocessing. For color photographic applications, the printhead is 100 mmlong, with a width which depends upon the ink jet type. The smallestprinthead designed is IJ38, which is 0.35 mm wide, giving a chip area of35 square mm. The printheads each contain 19,200 nozzles plus data andcontrol circuitry.

Ink is supplied to the back of the printhead by injection molded plasticink channels. The molding requires 50 micron features, which can becreated using a lithographically micromachined insert in a standardinjection molding tool. Ink flows through holes etched through the waferto the nozzle chambers fabricated on the front surface of the wafer. Theprinthead is connected to the camera circuitry by tape automatedbonding.

Tables of Drop-on-Demand Ink Jets

Eleven important characteristics of the fundamental operation ofindividual ink jet nozzles have been identified. These characteristicsare largely orthogonal, and so can be elucidated as an elevendimensional matrix. Most of the eleven axes of this matrix includeentries developed by the present assignee.

The following tables form the axes of an eleven dimensional table of inkjet types.

Actuator mechanism (18 types)

Basic operation mode (7 types)

Auxiliary mechanism (8 types)

Actuator amplification or modification method (17 types)

Actuator motion (19 types)

Nozzle refill method (4 types)

Method of restricting back-flow through inlet (10 types)

Nozzle clearing method (9 types)

Nozzle plate construction (9 types)

Drop ejection direction (5 types)

Ink type (7 types)

The complete eleven dimensional table represented by these axes contains36.9 billion possible configurations of ink jet nozzle. While not all ofthe possible combinations result in a viable ink jet technology, manymillion configurations are viable. It is clearly impractical toelucidate all of the possible configurations. Instead, certain ink jettypes have been investigated in detail. These are designated IJ01 toIJ45 above which matches the docket numbers in the table under theheading Cross References to Related Applications.

Other ink jet configurations can readily be derived from theseforty-five examples by substituting alternative configurations along oneor more of the 11 axes. Most of the IJ01 to IJ45 examples can be madeinto ink jet printheads with characteristics superior to any currentlyavailable ink jet technology.

Where there are prior art examples known to the inventor, one or more ofthese examples are listed in the examples column of the tables below.The IJ01 to IJ45 series are also listed in the examples column. In somecases, print technology may be listed more than once in a table, whereit shares characteristics with more than one entry.

Suitable applications for the ink jet technologies include: Homeprinters, Office network printers, Short run digital printers,Commercial print systems, Fabric printers, Pocket printers, Internet WWWprinters, Video printers, Medical imaging, Wide format printers,Notebook PC printers, Fax machines, Industrial printing systems,Photocopiers, Photographic minilabs etc.

The information associated with the aforementioned 11 dimensional matrixare set out in the following tables.

ACTUATOR MECHANISM (APPLIED ONLY TO SELECTED INK DROPS) DescriptionAdvantages Disadvantages Examples Thermal An electrothermal Large forceHigh power Canon Bubblejet bubble heater heats the ink to generated Inkcarrier 1979 Endo et al GB above boiling point, Simple limited to waterpatent 2,007,162 transferring significant construction Low efficiencyXerox heater-in- heat to the aqueous No moving parts High pit 1990Hawkins et ink. A bubble Fast operation temperatures al U.S. Pat. No.4,899,181 nucleates and quickly Small chip area required Hewlett-Packardforms, expelling the required for actuator High mechanical TIJ 1982Vaught et ink. stress al U.S. Pat. No. 4,490,728 The efficiency of theUnusual process is low, with materials required typically less thanLarge drive 0.05% of the electrical transistors energy being Cavitationcauses transformed into actuator failure kinetic energy of the Kogationreduces drop. bubble formation Large print heads are difficult tofabricate Piezoelectric A piezoelectric crystal Low power Very largearea Kyser et al U.S. Pat. No. such as lead consumption required foractuator 3,946,398 lanthanum zirconate Many ink types Difficult toZoltan U.S. Pat. No. (PZT) is electrically can be used integrate with3,683,212 activated, and either Fast operation electronics 1973 Stemmeexpands, shears, or High efficiency High voltage U.S. Pat. No. 3,747,120bends to apply drive transistors Epson Stylus pressure to the ink,required Tektronix ejecting drops. Full pagewidth IJ04 print headsimpractical due to actuator size Requires electrical poling in highfield strengths during manufacture Electrostrictive An electric field isLow power Low maximum Seiko Epson, used to activate consumption strain(approx. Usui et all JP electrostriction in Many ink types 0.01%)253401/96 relaxor materials such can be used Large area IJ04 as leadlanthanum Low thermal required for actuator zirconate titanate expansiondue to low strain (PLZT) or lead Electric field Response speed magnesiumniobate strength required is marginal (~10 μs) (PMN). (approx. 3.5 V/μm)High voltage can be generated drive transistors without difficultyrequired Does not require Full pagewidth electrical poling print headsimpractical due to actuator size Ferroelectric An electric field is Lowpower Difficult to IJ04 used to induce a phase consumption integratewith transition between the Many ink types electronics antiferroelectric(AFE) can be used Unusual and ferroelectric (FE) Fast operationmaterials such as phase. Perovskite (<1 μs) PLZSnT are materials such astin Relatively high required modified lead longitudinal strain Actuatorsrequire lanthanum zirconate High efficiency a large area titanate(PLZSnT) Electric field exhibit large strains of strength of around 3V/μm up to 1% associated can be readily with the AFE to FE providedphase transition. Electrostatic Conductive plates are Low powerDifficult to IJ02, IJ04 plates separated by a consumption operateelectrostatic compressible or fluid Many ink types devices in andielectric (usually air). can be used aqueous Upon application of a Fastoperation environment voltage, the plates The electrostatic attract eachother and actuator will displace ink, causing normally need to be dropejection. The separated from the conductive plates may ink be in a combor Very large area honeycomb structure, required to achieve or stackedto increase high forces the surface area and High voltage therefore theforce. drive transistors may be required Full pagewidth print heads arenot competitive due to actuator size Electrostatic A strong electricfield Low current High voltage 1989 Saito et al, pull is applied to theink, consumption required U.S. Pat. No. 4,799,068 on ink whereupon Lowtemperature May be damaged 1989 Miura et al, electrostatic attraction bysparks due to air U.S. Pat. No. 4,810,954 accelerates the ink breakdownTone-jet towards the print Required field medium. strength increases asthe drop size decreases High voltage drive transistors requiredElectrostatic field attracts dust Permanent An electromagnet Low powerComplex IJ07, IJ10 magnet directly attracts a consumption fabricationelectromagnetic permanent magnet, Many ink types Permanent displacingink and can be used magnetic material causing drop ejection. Fastoperation such as Neodymium Rare earth magnets High efficiency IronBoron (NdFeB) with a field strength Easy extension required. around 1Tesla can be from single nozzles High local used. Examples are: topagewidth print currents required Samarium Cobalt heads Copper (SaCo)and magnetic metalization should materials in the be used for longneodymium iron boron electromigration family (NdFeB, lifetime and lowNdDyFeBNb, resistivity NdDyFeB, etc) Pigmented inks are usuallyinfeasible Operating temperature limited to the Curie temperature(around 540 K) Soft A solenoid induced a Low power Complex IJ01, IJ05,IJ08, magnetic magnetic field in a soft consumption fabrication IJ10,IJ12, IJ14, core electromagnetic magnetic core or yoke Many ink typesMaterials not IJ15, IJ17 fabricated from a can be used usually presentin a ferrous material such Fast operation CMOS fab such as aselectroplated iron High efficiency NiFe, CoNiFe, or alloys such asCoNiFe Easy extension CoFe are required [1], CoFe, or NiFe from singlenozzles High local alloys. Typically, the to pagewidth print currentsrequired soft magnetic material heads Copper is in two parts, whichmetalization should are normally held be used for long apart by aspring. electromigration When the solenoid is lifetime and low actuated,the two parts resistivity attract, displacing the Electroplating is ink.required High saturation flux density is required (2.0-2.1 T isachievable with CoNiFe [1]) Lorenz The Lorenz force Low power Force actsas a IJ06, IJ11, IJ13, force acting on a current consumption twistingmotion IJ16 carrying wire in a Many ink types Typically, only a magneticfield is can be used quarter of the utilized. Fast operation solenoidlength This allows the High efficiency provides force in a magneticfield to be Easy extension useful direction supplied externally to fromsingle nozzles High local the print head, for to pagewidth printcurrents required example with rare heads Copper earth permanentmetalization should magnets. be used for long Only the currentelectromigration carrying wire need be lifetime and low fabricated onthe print- resistivity head, simplifying Pigmented inks materials areusually requirements. infeasible Magnetostriction The actuator uses theMany ink types Force acts as a Fischenbeck, giant magnetostrictive canbe used twisting motion U.S. Pat. No. 4,032,929 effect of materials Fastoperation Unusual IJ25 such as Terfenol-D (an Easy extension materialssuch as alloy of terbium, from single nozzles Terfenol-D are dysprosiumand iron to pagewidth print required developed at the Naval heads Highlocal Ordnance Laboratory, High force is currents required henceTer-Fe-NOL). available Copper For best efficiency, the metalizationshould actuator should be pre- be used for long stressed to approx. 8MPa. electromigration lifetime and low resistivity Pre-stressing may berequired Surface Ink under positive Low power Requires Silverbrook, EPtension pressure is held in a consumption supplementary force 0771 658A2 and reduction nozzle by surface Simple to effect drop related patenttension. The surface construction separation applications tension of theink is No unusual Requires special reduced below the materials requiredin ink surfactants bubble threshold, fabrication Speed may be causingthe ink to High efficiency limited by surfactant egress from the Easyextension properties nozzle. from single nozzles to pagewidth printheads Viscosity The ink viscosity is Simple Requires Silverbrook, EPreduction locally reduced to construction supplementary force 0771 658A2 and select which drops are No unusual to effect drop related patentto be ejected. A materials required in separation applications viscosityreduction can fabrication Requires special be achieved Easy extensionink viscosity electrothermally with from single nozzles properties mostinks, but special to pagewidth print High speed is inks can beengineered heads difficult to achieve for a 100:1 viscosity Requiresreduction. oscillating ink pressure A high temperature difference(typically 80 degrees) is required Acoustic An acoustic wave is Canoperate Complex drive 1993 Hadimioglu generated and without a nozzlecircuitry et al, EUP 550,192 focussed upon the plate Complex 1993 Elrodet al, drop ejection region. fabrication EUP 572,220 Low efficiency Poorcontrol of drop position Poor control of drop volume Thermo- An actuatorwhich Low power Efficient aqueous IJ03, IJ09, IJ17, elastic bend reliesupon differential consumption operation requires a IJ18, IJ19, IJ20,actuator thermal expansion Many ink types thermal insulator on IJ21,IJ22, IJ23, upon Joule heating is can be used the hot side IJ24, IJ27,IJ28, used. Simple planar Corrosion IJ29, IJ30, IJ31, fabricationprevention can be IJ32, IJ33, IJ34, Small chip area difficult IJ35,IJ36, IJ37, required for each Pigmented inks IJ38, IJ39, IJ40, actuatormay be infeasible, IJ41 Fast operation as pigment particles Highefficiency may jam the bend CMOS actuator compatible voltages andcurrents Standard MEMS processes can be used Easy extension from singlenozzles to pagewidth print heads High CTE A material with a very Highforce can Requires special IJ09, IJ17, IJ18, thermo- high coefficient ofbe generated material (e.g. PTFE) IJ20, IJ21, IJ22, elastic thermalexpansion Three methods of Requires a PTFE IJ23, IJ24, IJ27, actuator(CTE) such as PTFE deposition are deposition process, IJ28, IJ29, IJ30,polytetrafluoroethylene under development: which is not yet IJ31, IJ42,IJ43, (PTFE) is used. As chemical vapor standard in ULSI IJ44 high CTEmaterials deposition (CVD), fabs are usually non- spin coating, and PTFEdeposition conductive, a heater evaporation cannot be followedfabricated from a PTFE is a with high conductive material is candidatefor low temperature (above incorporated. A 50 μm dielectric constant350° C.) processing long PTFE bend insulation in ULSI Pigmented inksactuator with Very low power may be infeasible, polysilicon heater andconsumption as pigment particles 15 mW power input Many ink types mayjam the bend can provide 180 μN can be used actuator force and 10 μmSimple planar deflection. Actuator fabrication motions include: Smallchip area Bend required for each Push actuator Buckle Fast operationRotate High efficiency CMOS compatible voltages and currents Easyextension from single nozzles to pagewidth print heads Conductive Apolymer with a high High force can Requires special IJ24 polymercoefficient of thermal be generated materials thermo- expansion (such asVery low power development (High elastic PTFE) is doped with consumptionCTE conductive actuator conducting substances Many ink types polymer) toincrease its can be used Requires a PTFE conductivity to about 3 Simpleplanar deposition process, orders of magnitude fabrication which is notyet below that of copper. Small chip area standard in ULSI Theconducting required for each fabs polymer expands actuator PTFEdeposition when resistively Fast operation cannot be followed heated.High efficiency with high Examples of CMOS temperature (above conductingdopants compatible voltages 350° C.) processing include: and currentsEvaporation and Carbon nanotubes Easy extension CVD deposition Metalfibers from single nozzles techniques cannot Conductive polymers topagewidth print be used such as doped heads Pigmented inks polythiophenemay be infeasible, Carbon granules as pigment particles may jam the bendactuator Shape A shape memory alloy High force is Fatigue limits IJ26memory such as TiNi (also available (stresses maximum number alloy knownas Nitinol - of hundreds of MPa) of cycles Nickel Titanium alloy Largestrain is Low strain (1%) developed at the Naval available (more than isrequired to extend Ordnance Laboratory) 3%) fatigue resistance isthermally switched High corrosion Cycle rate between its weak resistancelimited by heat martensitic state and Simple removal its high stiffnessconstruction Requires unusual austenic state. The Easy extensionmaterials (TiNi) shape of the actuator from single nozzles The latentheat of in its martensitic state to pagewidth print transformation mustis deformed relative to heads be provided the austenic shape. Lowvoltage High current The shape change operation operation causesejection of a Requires pre- drop. stressing to distort the martensiticstate Linear Linear magnetic Linear Magnetic Requires unusual IJ12Magnetic actuators include the actuators can be semiconductor ActuatorLinear Induction constructed with materials such as Actuator (LIA),Linear high thrust, long soft magnetic alloys Permanent Magnet travel,and high (e.g. CoNiFe) Synchronous Actuator efficiency using Somevarieties (LPMSA), Linear planar also require Reluctance semiconductorpermanent magnetic Synchronous Actuator fabrication materials such as(LRSA), Linear techniques Neodymium iron Switched Reluctance Longactuator boron (NdFeB) Actuator (LSRA), and travel is available Requiresthe Linear Stepper Medium force is complex multi- Actuator (LSA).available phase drive circuitry Low voltage High current operationoperation

BASIC OPERATION MODE Description Advantages Disadvantages ExamplesActuator This is the simplest Simple operation Drop repetition Thermalink jet directly mode of operation: the No external rate is usuallyPiezoelectric ink pushes ink actuator directly fields required limitedto around 10 kHz. jet supplies sufficient Satellite drops However, thisIJ01, IJ02, IJ03, kinetic energy to expel can be avoided if is notfundamental IJ04, IJ05, IJ06, the drop. The drop drop velocity is lessto the method, but is IJ07, IJ09, IJ11, must have a sufficient than 4m/s related to the refill IJ12, IJ14, IJ16, velocity to overcome Can beefficient, method normally IJ20, IJ22, IJ23, the surface tension.depending upon the used IJ24, IJ25, IJ26, actuator used All of the dropIJ27, IJ28, IJ29, kinetic energy must IJ30, IJ31, IJ32, be provided bythe IJ33, IJ34, IJ35, actuator IJ36, IJ37, IJ38, Satellite drops IJ39,IJ40, IJ41, usually form if drop IJ42, IJ43, IJ44 velocity is greaterthan 4.5 m/s Proximity The drops to be Very simple print Requires closeSilverbrook, EP printed are selected by head fabrication can proximitybetween 0771 658 A2 and some manner (e.g. be used the print head andrelated patent thermally induced The drop the print media orapplications surface tension selection means transfer roller reductionof does not need to May require two pressurized ink). provide the energyprint heads printing Selected drops are required to separate alternaterows of the separated from the ink the drop from the image in the nozzleby nozzle Monolithic color contact with the print print heads are mediumor a transfer difficult roller. Electrostatic The drops to be Verysimple print Requires very Silverbrook, EP pull printed are selected byhead fabrication can high electrostatic 0771 658 A2 and on ink somemanner (e.g. be used field related patent thermally induced The dropElectrostatic field applications surface tension selection means forsmall nozzle Tone-Jet reduction of does not need to sizes is above airpressurized ink). provide the energy breakdown Selected drops arerequired to separate Electrostatic field separated from the ink the dropfrom the may attract dust in the nozzle by a nozzle strong electricfield. Magnetic The drops to be Very simple print Requires Silverbrook,EP pull on ink printed are selected by head fabrication can magnetic ink0771 658 A2 and some manner (e.g. be used Ink colors other relatedpatent thermally induced The drop than black are applications surfacetension selection means difficult reduction of does not need to Requiresvery pressurized ink). provide the energy high magnetic fields Selecteddrops are required to separate separated from the ink the drop from thein the nozzle by a nozzle strong magnetic field acting on the magneticink. Shutter The actuator moves a High speed (>50 kHz) Moving parts areIJ13, IJ17, IJ21 shutter to block ink operation can required flow to thenozzle. The be achieved due to Requires ink ink pressure is pulsedreduced refill time pressure modulator at a multiple of the Drop timingcan Friction and wear drop ejection be very accurate must be consideredfrequency. The actuator Stiction is energy can be very possible lowShuttered The actuator moves a Actuators with Moving parts are IJ08,IJ15, IJ18, grill shutter to block ink small travel can be required IJ19flow through a grill to used Requires ink the nozzle. The shutterActuators with pressure modulator movement need only small force can beFriction and wear be equal to the width used must be considered of thegrill holes. High speed (>50 kHz) Stiction is operation can possible beachieved Pulsed A pulsed magnetic Extremely low Requires an IJ10magnetic field attracts an ‘ink energy operation is external pulsed pullon ink pusher’ at the drop possible magnetic field pusher ejectionfrequency. An No heat Requires special actuator controls a dissipationmaterials for both catch, which prevents problems the actuator and thethe ink pusher from ink pusher moving when a drop is Complex not to beejected. construction

AUXILIARY MECHANISM (APPLIED TO ALL NOZZLES) Description AdvantagesDisadvantages Examples None The actuator directly Simplicity of Dropejection Most ink jets, fires the ink drop, and construction energy mustbe including there is no external Simplicity of supplied bypiezoelectric and field or other operation individual nozzle thermalbubble. mechanism required. Small physical actuator IJ01, IJ02, IJ03,size IJ04, IJ05, IJ07, IJ09, IJ11, IJ12, IJ14, IJ20, IJ22, IJ23, IJ24,IJ25, IJ26, IJ27, IJ28, IJ29, IJ30, IJ31, IJ32, IJ33, IJ34, IJ35, IJ36,IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44 Oscillating The inkpressure Oscillating ink Requires external Silverbrook, EP ink pressureoscillates, providing pressure can provide ink pressure 0771 658 A2 and(including much of the drop a refill pulse, oscillator related patentacoustic ejection energy. The allowing higher Ink pressure applicationsstimulation) actuator selects which operating speed phase and amplitudeIJ08, IJ13, IJ15, drops are to be fired The actuators must be carefullyIJ17, IJ18, IJ19, by selectively may operate with controlled IJ21blocking or enabling much lower energy Acoustic nozzles. The inkAcoustic lenses reflections in the ink pressure oscillation can be usedto focus chamber must be may be achieved by the sound on the designedfor vibrating the print nozzles head, or preferably by an actuator inthe ink supply. Media The print head is Low power Precision Silverbrook,EP proximity placed in close High accuracy assembly required 0771 658 A2and proximity to the print Simple print head Paper fibers may relatedpatent medium. Selected construction cause problems applications dropsprotrude from Cannot print on the print head further rough substratesthan unselected drops, and contact the print medium. The drop soaks intothe medium fast enough to cause drop separation. Transfer Drops areprinted to a High accuracy Bulky Silverbrook, EP roller transfer rollerinstead Wide range of Expensive 0771 658 A2 and of straight to the printprint substrates can Complex related patent medium. A transfer be usedconstruction applications roller can also be used Ink can be driedTektronix hot for proximity drop on the transfer roller meltpiezoelectric separation. ink jet Any of the IJ series Electrostatic Anelectric field is Low power Field strength Silverbrook, EP used toaccelerate Simple print head required for 0771 658 A2 and selected dropstowards construction separation of small related patent the printmedium. drops is near or applications above air Tone-Jet breakdownDirect A magnetic field is Low power Requires Silverbrook, EP magneticused to accelerate Simple print head magnetic ink 0771 658 A2 and fieldselected drops of construction Requires strong related patent magneticink towards magnetic field applications the print medium. Cross Theprint head is Does not require Requires external IJ06, IJ16 magneticplaced in a constant magnetic materials magnet field magnetic field. Theto be integrated in Current densities Lorenz force in a the print headmay be high, current carrying wire manufacturing resulting in is used tomove the process electromigration actuator. problems Pulsed A pulsedmagnetic Very low power Complex print IJ10 magnetic field is used tooperation is possible head construction field cyclically attract a Smallprint head Magnetic paddle, which pushes size materials required in onthe ink. A small print head actuator moves a catch, which selectivelyprevents the paddle from moving.

ACTUATOR AMPLIFICATION OR MODIFICATION METHOD Description AdvantagesDisadvantages Examples None No actuator Operational Many actuatorThermal Bubble mechanical simplicity mechanisms have Ink jetamplification is used. insufficient travel, IJ01, IJ02, IJ06, Theactuator directly or insufficient force, IJ07, IJ16, IJ25, drives thedrop to efficiently drive IJ26 ejection process. the drop ejectionprocess Differential An actuator material Provides greater High stressesare Piezoelectric expansion expands more on one travel in a reducedinvolved IJ03, IJ09, IJ17, bend side than on the other. print head areaCare must be IJ18, IJ19, IJ20, actuator The expansion may be taken thatthe IJ21, IJ22, IJ23, thermal, piezoelectric, materials do not IJ24,IJ27, IJ29, magnetostrictive, or delaminate IJ30, IJ31, IJ32, othermechanism. The Residual bend IJ33, IJ34, IJ35, bend actuator convertsresulting from high IJ36, IJ37, IJ38, a high force low traveltemperature or high IJ39, IJ42, IJ43, actuator mechanism to stressduring IJ44 high travel, lower formation force mechanism. Transient Atrilayer bend Very good High stresses are IJ40, IJ41 bend actuator wherethe two temperature stability involved actuator outside layers are Highspeed, as a Care must be identical. This cancels new drop can be takenthat the bend due to ambient fired before heat materials do nottemperature and dissipates delaminate residual stress. The Cancelsresidual actuator only responds stress of formation to transient heatingof one side or the other. Reverse The actuator loads a Better couplingFabrication IJ05, IJ11 spring spring. When the to the ink complexityactuator is turned off, High stress in the the spring releases. springThis can reverse the force/distance curve of the actuator to make itcompatible with the force/time requirements of the drop ejection.Actuator A series of thin Increased travel Increased Some stackactuators are stacked. Reduced drive fabrication piezoelectric ink jetsThis can be voltage complexity IJ04 appropriate where Increasedactuators require high possibility of short electric field strength,circuits due to such as electrostatic pinholes and piezoelectricactuators. Multiple Multiple smaller Increases the Actuator forces IJ12,IJ13, IJ18, actuators actuators are used force available from may notadd IJ20, IJ22, IJ28, simultaneously to an actuator linearly, reducingIJ42, IJ43 move the ink. Each Multiple efficiency actuator need provideactuators can be only a portion of the positioned to control forcerequired. ink flow accurately Linear A linear spring is used Matches lowRequires print IJ15 Spring to transform a motion travel actuator withhead area for the with small travel and higher travel spring high forceinto a requirements longer travel, lower Non-contact force motion.method of motion transformation Coiled A bend actuator is Increasestravel Generally IJ17, IJ21, IJ34, actuator coiled to provide Reduceschip restricted to planar IJ35 greater travel in a area implementationsreduced chip area. Planar due to extreme implementations are fabricationdifficulty relatively easy to in other orientations. fabricate. FlexureA bend actuator has a Simple means of Care must be IJ10, IJ19, IJ33 bendsmall region near the increasing travel of taken not to exceed actuatorfixture point, which a bend actuator the elastic limit in flexes muchmore the flexure area readily than the Stress remainder of thedistribution is very actuator. The actuator uneven flexing iseffectively Difficult to converted from an accurately model even coilingto an with finite element angular bend, resulting analysis in greatertravel of the actuator tip. Catch The actuator controls a Very lowComplex IJ10 small catch. The catch actuator energy construction eitherenables or Very small Requires external disables movement of actuatorsize force an ink pusher that is Unsuitable for controlled in a bulkpigmented inks manner. Gears Gears can be used to Low force, low Movingparts are IJ13 increase travel at the travel actuators can requiredexpense of duration. be used Several actuator Circular gears, rack Canbe fabricated cycles are required and pinion, ratchets, using standardMore complex and other gearing surface MEMS drive electronics methodscan be used. processes Complex construction Friction, friction, and wearare possible Buckle plate A buckle plate can be Very fast Must staywithin S. Hirata et al, used to change a slow movement elastic limits ofthe “An Ink-jet Head actuator into a fast achievable materials for longUsing Diaphragm motion. It can also device life Microactuator”, converta high force, High stresses Proc. IEEE MEMS, low travel actuatorinvolved February 1996, pp into a high travel, Generally high 418-423.medium force motion. power requirement IJ18, IJ27 Tapered A taperedmagnetic Linearizes the Complex IJ14 magnetic pole can increase magneticconstruction pole travel at the expense force/distance curve of force.Lever A lever and fulcrum is Matches low High stress IJ32, IJ36, IJ37used to transform a travel actuator with around the fulcrum motion withsmall higher travel travel and high force requirements into a motionwith Fulcrum area has longer travel and no linear movement, lower force.The lever and can be used for can also reverse the a fluid sealdirection of travel. Rotary The actuator is High mechanical Complex IJ28impeller connected to a rotary advantage construction impeller. A smallThe ratio of force Unsuitable for angular deflection of to travel of thepigmented inks the actuator results in actuator can be a rotation of thematched to the impeller vanes, which nozzle requirements push the inkagainst by varying the stationary vanes and number of impeller out ofthe nozzle. vanes Acoustic A refractive or No moving parts Large area1993 Hadimioglu lens diffractive (e.g. zone required et al, EUP 550,192plate) acoustic lens is Only relevant for 1993 Elrod et al, used toconcentrate acoustic ink jets EUP 572,220 sound waves. Sharp A sharppoint is used Simple Difficult to Tone-jet conductive to concentrate anconstruction fabricate using point electrostatic field. standard VLSIprocesses for a surface ejecting ink- jet Only relevant forelectrostatic ink jets

ACTUATOR MOTION Description Advantages Disadvantages Examples Volume Thevolume of the Simple High energy is Hewlett-Packard expansion actuatorchanges, construction in the typically required to Thermal Ink jetpushing the ink in all case of thermal ink achieve volume CanonBubblejet directions. jet expansion. This leads to thermal stress,cavitation, and kogation in thermal ink jet implementations Linear, Theactuator moves in Efficient High fabrication IJ01, IJ02, IJ04, normal toa direction normal to coupling to ink complexity may be IJ07, IJ11, IJ14chip surface the print head surface. drops ejected required to achieveThe nozzle is typically normal to the perpendicular in the line ofsurface motion movement. Parallel to The actuator moves Suitable forFabrication IJ12, IJ13, IJ15, chip surface parallel to the print planarfabrication complexity IJ33,, IJ34, IJ35, head surface. Drop FrictionIJ36 ejection may still be Stiction normal to the surface. Membrane Anactuator with a The effective Fabrication 1982 Howkins push high forcebut small area of the actuator complexity U.S. Pat. No. 4,459,601 areais used to push a becomes the Actuator size stiff membrane that ismembrane area Difficulty of in contact with the ink. integration in aVLSI process Rotary The actuator causes Rotary levers Device IJ05, IJ08,IJ13, the rotation of some may be used to complexity IJ28 element, sucha grill or increase travel May have impeller Small chip area friction ata pivot requirements point Bend The actuator bends A very small Requiresthe 1970 Kyser et al when energized. This change in actuator to be madeU.S. Pat. No. 3,946,398 may be due to dimensions can be from at leasttwo 1973 Stemme differential thermal converted to a large distinctlayers, or to U.S. Pat. No. 3,747,120 expansion, motion. have a thermalIJ03, IJ09, IJ10, piezoelectric difference across the IJ19, IJ23, IJ24,expansion, actuator IJ25, IJ29, IJ30, magnetostriction, or IJ31, IJ33,IJ34, other form of relative IJ35 dimensional change. Swivel Theactuator swivels Allows operation Inefficient IJ06 around a centralpivot. where the net linear coupling to the ink This motion is suitableforce on the paddle motion where there are is zero opposite forces Smallchip area applied to opposite requirements sides of the paddle, e.g.Lorenz force. Straighten The actuator is Can be used with Requirescareful IJ26, IJ32 normally bent, and shape memory balance of stressesstraightens when alloys where the to ensure that the energized. austenicphase is quiescent bend is planar accurate Double The actuator bends inOne actuator can Difficult to make IJ36, IJ37, IJ38 bend one directionwhen be used to power the drops ejected by one element is two nozzles.both bend directions energized, and bends Reduced chip identical. theother way when size. A small another element is Not sensitive toefficiency loss energized. ambient temperature compared to equivalentsingle bend actuators. Shear Energizing the Can increase the Not readily1985 Fishbeck actuator causes a shear effective travel of applicable toother U.S. Pat. No. 4,584,590 motion in the actuator piezoelectricactuator material. actuators mechanisms Radial constriction The actuatorsqueezes Relatively easy High force 1970 Zoltan U.S. Pat. No. an inkreservoir, to fabricate single required 3,683,212 forcing ink from anozzles from glass Inefficient constricted nozzle. tubing as Difficultto macroscopic integrate with VLSI structures processes Coil/uncoil Acoiled actuator Easy to fabricate Difficult to IJ17, IJ21, IJ34, uncoilsor coils more as a planar VLSI fabricate for non- IJ35 tightly. Themotion of process planar devices the free end of the Small area Poorout-of-plane actuator ejects the ink. required, therefore stiffness lowcost Bow The actuator bows (or Can increase the Maximum travel IJ16,IJ18, IJ27 buckles) in the middle speed of travel is constrained whenenergized. Mechanically High force rigid required Push-Pull Twoactuators control The structure is Not readily IJ18 a shutter. Oneactuator pinned at both ends, suitable for ink jets pulls the shutter,and so has a high out-of- which directly push the other pushes it. planerigidity the ink Curl A set of actuators curl Good fluid flow DesignIJ20, IJ42 inwards inwards to reduce the to the region behind complexityvolume of ink that the actuator they enclose. increases efficiency CurlA set of actuators curl Relatively simple Relatively large IJ43 outwardsoutwards, pressurizing construction chip area ink in a chambersurrounding the actuators, and expelling ink from a nozzle in thechamber. Iris Multiple vanes enclose High efficiency High fabricationIJ22 a volume of ink. These Small chip area complexity simultaneouslyrotate, Not suitable for reducing the volume pigmented inks between thevanes. Acoustic The actuator vibrates The actuator can Large area 1993Hadimioglu vibration at a high frequency. be physically distant requiredfor et al, EUP 550,192 from the ink efficient operation 1993 Elrod etal, at useful frequencies EUP 572,220 Acoustic coupling and crosstalkComplex drive circuitry Poor control of drop volume and position None Invarious ink jet No moving parts Various other Silverbrook, EP designsthe actuator tradeoffs are 0771 658 A2 and does not move. required torelated patent eliminate moving applications parts Tone-jet

NOZZLE REFILL METHOD Description Advantages Disadvantages ExamplesSurface This is the normal way Fabrication Low speed Thermal ink jettension that ink jets are simplicity Surface tension Piezoelectric inkrefilled. After the Operational force relatively jet actuator isenergized, simplicity small compared to IJ01-IJ07, IJ10-IJ14, ittypically returns actuator force IJ16, IJ20, rapidly to its normal Longrefill time IJ22-IJ45 position. This rapid usually dominates returnsucks in air the total repetition through the nozzle rate opening. Theink surface tension at the nozzle then exerts a small force restoringthe meniscus to a minimum area. This force refills the nozzle. ShutteredInk to the nozzle High speed Requires IJ08, IJ13, IJ15, oscillatingchamber is provided at Low actuator common ink IJ17, IJ18, IJ19, inkpressure a pressure that energy, as the pressure oscillator IJ21oscillates at twice the actuator need only May not be drop ejection openor close the suitable for frequency. When a shutter, instead ofpigmented inks drop is to be ejected, ejecting the ink drop the shutteris opened for 3 half cycles: drop ejection, actuator return, and refill.The shutter is then closed to prevent the nozzle chamber emptying duringthe next negative pressure cycle. Refill After the main High speed, asRequires two IJ09 actuator actuator has ejected a the nozzle isindependent drop a second (refill) actively refilled actuators pernozzle actuator is energized. The refill actuator pushes ink into thenozzle chamber. The refill actuator returns slowly, to prevent itsreturn from emptying the chamber again. Positive ink The ink is held aslight High refill rate, Surface spill Silverbrook, EP pressure positivepressure. therefore a high must be prevented 0771 658 A2 and After theink drop is drop repetition rate Highly related patent ejected, thenozzle is possible hydrophobic print applications chamber fills quicklyhead surfaces are Alternative for:, as surface tension and requiredIJ01-IJ07, IJ10-IJ14, ink pressure both IJ16, IJ20, IJ22-IJ45 operate torefill the nozzle.

METHOD OF RESTRICTING BACK-FLOW THROUGH INLET Description AdvantagesDisadvantages Examples Long inlet The ink inlet channel Designsimplicity Restricts refill Thermal ink jet channel to the nozzlechamber Operational rate Piezoelectric ink is made long and simplicityMay result in a jet relatively narrow, Reduces relatively large chipIJ42, IJ43 relying on viscous crosstalk area drag to reduce inlet Onlypartially back-flow. effective Positive ink The ink is under a Dropselection Requires a Silverbrook, EP pressure positive pressure, so andseparation method (such as a 0771 658 A2 and that in the quiescentforces can be nozzle rim or related patent state some of the ink reducedeffective applications drop already protrudes Fast refill timehydrophobizing, or Possible from the nozzle. both) to prevent operationof the This reduces the flooding of the following: IJ01-IJ07, pressurein the nozzle ejection surface of IJ09-IJ12, chamber which is the printhead. IJ14, IJ16, IJ20, required to eject a IJ22,, IJ23-IJ34, certainvolume of ink. IJ36-IJ41, IJ44 The reduction in chamber pressure resultsin a reduction in ink pushed out through the inlet. Baffle One or morebaffles The refill rate is Design HP Thermal Ink are placed in the inletnot as restricted as complexity Jet ink flow. When the the long inletMay increase Tektronix actuator is energized, method. fabricationpiezoelectric ink jet the rapid ink Reduces complexity (e.g. movementcreates crosstalk Tektronix hot melt eddies which restrict Piezoelectricprint the flow through the heads). inlet. The slower refill process isunrestricted, and does not result in eddies. Flexible flap In thismethod recently Significantly Not applicable to Canon restrictsdisclosed by Canon, reduces back-flow most ink jet inlet the expandingactuator for edge-shooter configurations (bubble) pushes on a thermalink jet Increased flexible flap that devices fabrication restricts theinlet. complexity Inelastic deformation of polymer flap results in creepover extended use Inlet filter A filter is located Additional Restrictsrefill IJ04, IJ12, IJ24, between the ink inlet advantage of ink rateIJ27, IJ29, IJ30 and the nozzle filtration May result in chamber. Thefilter Ink filter may be complex has a multitude of fabricated with noconstruction small holes or slots, additional process restricting inkflow. steps The filter also removes particles which may block thenozzle. Small inlet The ink inlet channel Design simplicity Restrictsrefill IJ02, IJ37, IJ44 compared to the nozzle chamber rate to nozzlehas a substantially May result in a smaller cross section relativelylarge chip than that of the nozzle, area resulting in easier ink Onlypartially egress out of the effective nozzle than out of the inlet.Inlet shutter A secondary actuator Increases speed Requires separateIJ09 controls the position of of the ink-jet print refill actuator and ashutter, closing off head operation drive circuit the ink inlet when themain actuator is energized. The inlet is The method avoids the Back-flowRequires careful IJ01, IJ03, IJ05, located problem of inlet back-problem is design to minimize IJ06, IJ07, IJ10, behind the flow byarranging the eliminated the negative IJ11, IJ14, IJ16, ink-pushingink-pushing surface of pressure behind the IJ22, IJ23, IJ25, surface theactuator between paddle IJ28, IJ31, IJ32, the inlet and the IJ33, IJ34,IJ35, nozzle. IJ36, IJ39, IJ40, IJ41 Part of the The actuator and aSignificant Small increase in IJ07, IJ20, IJ26, actuator wall of the inkreductions in back- fabrication IJ38 moves to chamber are arranged flowcan be complexity shut off the so that the motion of achieved inlet theactuator closes off Compact designs the inlet. possible Nozzle In someconfigurations Ink back-flow None related to Silverbrook, EP actuator ofink jet, there is no problem is ink back-flow on 0771 658 A2 and doesnot expansion or eliminated actuation related patent result in inkmovement of an applications back-flow actuator which may Valve-jet causeink back-flow Tone-jet through the inlet.

Description Advantages Disadvantages Examples NOZZLE CLEARING METHODNormal All of the nozzles are No added May not be Most ink jet nozzlefiring fired periodically, complexity on the sufficient to systemsbefore the ink has a print head displace dried ink IJ01, IJ02, IJ03,chance to dry. When IJ04, IJ05, IJ06, not in use the nozzles IJ07, IJ09,IJ10, are sealed (capped) IJ11, IJ12, IJ14, against air. IJ16, IJ20,IJ22, The nozzle firing is IJ23, IJ24, IJ25, usually performed IJ26,IJ27, IJ28, during a special IJ29, IJ30, IJ31, clearing cycle, afterIJ32, IJ33, IJ34, first moving the print IJ36, IJ37, IJ38, head to acleaning IJ39, IJ40, IJ41, station. IJ42, IJ43, IJ44, IJ45 Extra Insystems which heat Can be highly Requires higher Silverbrook, EP powerto the ink, but do not boil effective if the drive voltage for 0771 658A2 and ink heater it under normal heater is adjacent to clearing relatedpatent situations, nozzle the nozzle May require applications clearingcan be larger drive achieved by over- transistors powering the heaterand boiling ink at the nozzle. Rapid The actuator is fired in Does notrequire Effectiveness May be used succession rapid succession. In extradrive circuits depends with: IJ01, IJ02, of actuator someconfigurations, on the print head substantially upon IJ03, IJ04, IJ05,pulses this may cause heat Can be readily the configuration of IJ06,IJ07, IJ09, build-up at the nozzle controlled and the ink jet nozzleIJ10, IJ11, IJ14, which boils the ink, initiated by digital IJ16, IJ20,IJ22, clearing the nozzle. In logic IJ23, IJ24, IJ25, other situations,it may IJ27, IJ28, IJ29, cause sufficient IJ30, IJ31, IJ32, vibrationsto dislodge IJ33, IJ34, IJ36, clogged nozzles. IJ37, IJ38, IJ39, IJ40,IJ41, IJ42, IJ43, IJ44, IJ45 Extra Where an actuator is A simple Notsuitable May be used power to not normally driven to solution wherewhere there is a with: IJ03, IJ09, ink pushing the limit of its motion,applicable hard limit to IJ16, IJ20, IJ23, actuator nozzle clearing maybe actuator movement IJ24, IJ25, IJ27, assisted by providing IJ29, IJ30,IJ31, an enhanced drive IJ32, IJ39, IJ40, signal to the actuator. IJ41,IJ42, IJ43, IJ44, IJ45 Acoustic An ultrasonic wave is A high nozzle HighIJ08, IJ13, IJ15, resonance applied to the ink clearing capabilityimplementation cost IJ17, IJ18, IJ19, chamber. This wave is can beachieved if system does not IJ21 of an appropriate May be alreadyinclude an amplitude and implemented at very acoustic actuator frequencyto cause low cost in systems sufficient force at the which alreadynozzle to clear include acoustic blockages. This is actuators easiest toachieve if the ultrasonic wave is at a resonant frequency of the inkcavity. Nozzle A microfabricated Can clear Accurate Silverbrook, EPclearing plate is pushed against severely clogged mechanical 0771 658 A2and plate the nozzles. The plate nozzles alignment is related patent hasa post for every required applications nozzle. A post moves Moving partsare through each nozzle, required displacing dried ink. There is risk ofdamage to the nozzles Accurate fabrication is required Ink The pressureof the ink May be effective Requires May be used pressure is temporarilywhere other pressure pump or with all IJ series ink pulse increased sothat ink methods cannot be other pressure jets streams from all of theused actuator nozzles. This may be Expensive used in conjunctionWasteful of ink with actuator energizing. Print head A flexible ‘blade’is Effective for Difficult to use if Many ink jet wiper wiped across theprint planar print head print head surface is systems head surface. Thesurfaces non-planar or very blade is usually Low cost fragile fabricatedfrom a Requires flexible polymer, e.g. mechanical parts rubber orsynthetic Blade can wear elastomer. out in high volume print systemsSeparate A separate heater is Can be effective Fabrication Can be usedwith ink boiling provided at the nozzle where other nozzle complexitymany IJ series ink heater although the normal clearing methods jets drope-ection cannot be used mechanism does not Can be require it. Theheaters implemented at no do not require additional cost in individualdrive some ink jet circuits, as many configurations nozzles can becleared simultaneously, and no imaging is required. NOZZLE PLATECONSTRUCTION Electroformed A nozzle plate is Fabrication High HewlettPackard nickel separately fabricated simplicity temperatures and ThermalInk jet from electroformed pressures are nickel, and bonded to requiredto bond the print head chip. nozzle plate Minimum thickness constraintsDifferential thermal expansion Laser Individual nozzle No masks Eachhole must Canon Bubblejet ablated or holes are ablated by an required beindividually 1988 Sercel et drilled intense UV laser in a Can be quitefast formed al., SPIE, Vol. 998 polymer nozzle plate, which is Somecontrol Special Excimer Beam typically a polymer over nozzle profileequipment required Applications, pp. such as polyimide or is possibleSlow where there 76-83 polysulphone Equipment are many thousands 1993Watanabe required is relatively of nozzles per print et al., U.S. Pat.No. low cost head 5,208,604 May produce thin burrs at exit holes SiliconA separate nozzle High accuracy is Two part K. Bean, IEEE micromachinedplate is attainable construction Transactions on micromachined from Highcost Electron Devices, single crystal silicon, Requires Vol. ED-25, No.10, and bonded to the precision alignment 1978, pp 1185-1195 print headwafer. Nozzles may be Xerox 1990 clogged by adhesive Hawkins et al.,U.S. Pat. No. 4,899,181 Glass Fine glass capillaries No expensive Verysmall 1970 Zoltan U.S. Pat. No. capillaries are drawn from glassequipment required nozzle sizes are 3,683,212 tubing. This method Simpleto make difficult to form has been used for single nozzles Not suitedfor making individual mass production nozzles, but is difficult to usefor bulk manufacturing of print heads with thousands of nozzles.Monolithic, The nozzle plate is High accuracy Requires Silverbrook, EPsurface deposited as a layer (<1 μm) sacrificial layer 0771 658 A2 andmicromachined using standard VLSI Monolithic under the nozzle relatedpatent using VLSI deposition techniques. Low cost plate to form theapplications lithographic Nozzles are etched in Existing nozzle chamberIJ01, IJ02, IJ04, processes the nozzle plate using processes can beSurface may be IJ11, IJ12, IJ17, VLSI lithography and used fragile tothe touch IJ18, IJ20, IJ22, etching. IJ24, IJ27, IJ28, IJ29, IJ30, IJ31,IJ32, IJ33, IJ34, IJ36, IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44Monolithic, The nozzle plate is a High accuracy Requires long IJ03,IJ05, IJ06, etched buried etch stop in the (<1 μm) etch times IJ07,IJ08, IJ09, through wafer. Nozzle Monolithic Requires a IJ10, IJ13,IJ14, substrate chambers are etched in Low cost support wafer IJ15,IJ16, IJ19, the front of the wafer, No differential IJ21, IJ23, IJ25,and the wafer is expansion IJ26 thinned from the back side. Nozzles arethen etched in the etch stop layer. No nozzle Various methods have Nonozzles to Difficult to Ricoh 1995 plate been tried to eliminate becomeclogged control drop Sekiya et al U.S. Pat. No. the nozzles entirely, toposition accurately 5,412,413 prevent nozzle Crosstalk 1993 Hadimiogluclogging. These problems et al EUP 550,192 include thermal bubble 1993Elrod et al mechanisms and EUP 572,220 acoustic lens mechanisms TroughEach drop ejector has Reduced Drop firing IJ35 a trough throughmanufacturing direction is sensitive which a paddle moves. complexity towicking. There is no nozzle Monolithic plate. Nozzle slit Theelimination of No nozzles to Difficult to 1989 Saito et al instead ofnozzle holes and become clogged control drop U.S. Pat. No. 4,799,068individual replacement by a slit position accurately nozzlesencompassing many Crosstalk actuator positions problems reduces nozzleclogging, but increases crosstalk due to ink surface waves

DROP EJECTION DIRECTION Description Advantages Disadvantages ExamplesEdge Ink flow is along the Simple Nozzles limited Canon Bubblejet (‘edgesurface of the chip, construction to edge 1979 Endo et al GB shooter’)and ink drops are No silicon High resolution patent 2,007,162 ejectedfrom the chip etching required is difficult Xerox heater-in- edge. Goodheat Fast color pit 1990 Hawkins et sinking via substrate printingrequires al U.S. Pat. No. 4,899,181 Mechanically one print head perTone-jet strong color Ease of chip handing Surface Ink flow is along theNo bulk silicon Maximum ink Hewlett-Packard (‘roof surface of the chip,etching required flow is severely TIJ 1982 Vaught et shooter’) and inkdrops are Silicon can make restricted al U.S. Pat. No. 4,490,728 ejectedfrom the chip an effective heat IJ02, IJ11, IJ12, surface, normal to thesink IJ20, IJ22 plane of the chip. Mechanical strength Through Ink flowis through the High ink flow Requires bulk Silverbrook, EP chip, chip,and ink drops are Suitable for silicon etching 0771 658 A2 and forwardejected from the front pagewidth print related patent (‘up surface ofthe chip. heads applications shooter’) High nozzle IJ04, IJ17, IJ18,packing density IJ24, IJ27-IJ45 therefore low manufacturing cost ThroughInk flow is through the High ink flow Requires wafer IJ01, IJ03, IJ05,chip, chip, and ink drops are Suitable for thinning IJ06, IJ07, IJ08,reverse ejected from the rear pagewidth print Requires special IJ09,IJ10, IJ13, (‘down surface of the chip. heads handling during IJ14,IJ15, IJ16, shooter’) High nozzle manufacture IJ19, IJ21, IJ23, packingdensity IJ25, IJ26 therefore low manufacturing cost Through Ink flow isthrough the Suitable for Pagewidth print Epson Stylus actuator actuator,which is not piezoelectric print heads require Tektronix hot fabricatedas part of heads several thousand melt piezoelectric the same substrateas connections to drive ink jets the drive transistors. circuits Cannotbe manufactured in standard CMOS fabs Complex assembly required

INK TYPE Description Advantages Disadvantages Examples Aqueous, Waterbased ink which Environmentally Slow drying Most existing ink dyetypically contains: friendly Corrosive jets water, dye, surfactant, Noodor Bleeds on paper All IJ series ink humectant, and May jets biocide.strikethrough Silverbrook, EP Modern ink dyes have Cockles paper 0771658 A2 and high water-fastness, related patent light fastnessapplications Aqueous, Water based ink which Environmentally Slow dryingIJ02, IJ04, IJ21, pigment typically contains: friendly Corrosive IJ26,IJ27, IJ30 water, pigment, No odor Pigment may Silverbrook, EPsurfactant, humectant, Reduced bleed clog nozzles 0771 658 A2 and andbiocide. Reduced wicking Pigment may related patent Pigments have anReduced clog actuator applications advantage in reduced strikethroughmechanisms Piezoelectric ink- bleed, wicking and Cockles paper jetsstrikethrough. Thermal ink jets (with significant restrictions) MethylMEK is a highly Very fast drying Odorous All IJ series ink Ethylvolatile solvent used Prints on various Flammable jets Ketone forindustrial printing substrates such as (MEK) on difficult surfacesmetals and plastics such as aluminum cans. Alcohol Alcohol based inksFast drying Slight odor All IJ series ink (ethanol, 2- can be used wherethe Operates at sub- Flammable jets butanol, printer must operate atfreezing and others) temperatures below temperatures the freezing pointof Reduced paper water. An example of cockle this is in-camera Low costconsumer photographic printing. Phase The ink is solid at No dryingtime- High viscosity Tektronix hot change room temperature, and inkinstantly freezes Printed ink melt piezoelectric (hot melt) is melted inthe print on the print medium typically has a ink jets head beforejetting. Almost any print ‘waxy’ feel 1989 Nowak Hot melt inks aremedium can be used Printed pages U.S. Pat. No. 4,820,346 usually waxbased, No paper cockle may ‘block’ All IJ series ink with a meltingpoint occurs Ink temperature jets around 80° C. After No wicking may beabove the jetting the ink freezes occurs curie point of almost instantlyupon No bleed occurs permanent magnets contacting the print Nostrikethrough Ink heaters medium or a transfer occurs consume powerroller. Long warm-up time Oil Oil based inks are High solubility Highviscosity: All IJ series ink extensively used in medium for some this isa significant jets offset printing. They dyes limitation for use in haveadvantages in Does not cockle ink jets, which improved paper usuallyrequire a characteristics on Does not wick low viscosity. Some paper(especially no through paper short chain and wicking or cockle).multi-branched oils Oil soluble dies and have a sufficiently pigmentsare required. low viscosity. Slow drying Microemulsion A microemulsionis a Stops ink bleed Viscosity higher All IJ series ink stable, selfforming High dye than water jets emulsion of oil, water, solubility Costis slightly and surfactant. The Water, oil, and higher than watercharacteristic drop size amphiphilic soluble based ink is less than 100nm, dies can be used High surfactant and is determined by Can stabilizeconcentration the preferred curvature pigment required (around of thesurfactant. suspensions 5%)

1. A method for manufacturing an inkjet nozzle, the method comprisingthe steps of: depositing a plastics material layer on a substrateincorporating heater actuator circuitry; and etching the plasticsmaterial layer to form a nozzle rim defining an ink ejection portthrough which ink can be ejected and a plurality of elongate actuatorarms extending radially with respect to the nozzle rim, such that eachactuator arm incorporates heater actuator circuitry.
 2. A method asclaimed in claim 1, which includes the step of etching a tapered inkchamber in the substrate so that the ink port and ink chamber are influid communication with each other.
 3. A method as claimed in claim 2,which includes the step of etching an ink supply inlet in the substrateat an apex of the tapered ink chamber, the ink supply inlet being influid communication with the ink chamber.
 4. A method as claimed inclaim 3 wherein, prior to the step of depositing the plastics material,the method further includes the steps of depositing a metal layer on thesubstrate and etching the metal layer to define the heater actuatorcircuitry.
 5. A method as claimed in claim 4, wherein the metal layer isdeposited in a recess etched in the substrate.
 6. A method as claimed inclaim 1, wherein a semiconductor wafer and one or more metal layers areformed on the substrate.
 7. A method as claimed in claim 1, wherein theplastic material layer includes polytetrafluoroethylene (PTFE).